Patent Assignment
Reel/Frame 042590/0849
Assignment of Assignor's Interest
Recorded: 2017-06-05
Pages: 3
Assignor
WATANABE, KAZUSHI
Executed: 2017-05-29
Assignee
MURATA MANUFACTURING CO., LTD.
10-1 HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Electronic Component Device, Method of Mounting Electronic Component Device on Circuit Board, and Mounting Structure of Electronic Component Device on Circuit Board