Electronic component device, method of mounting electronic component device on circuit board, and mounting structure of electronic component device on circuit board
An electronic component device includes a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface, at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by joining the terminal electrode to the mount electrode, and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted. The sealing resin layer includes a region with a large thickness, and a top surface including an inclination.
1. An electronic component device comprising:
a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface;
at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by the terminal electrode being joined to the mount electrode; and
a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted; wherein
the sealing resin layer includes an increased thickness region, and a top surface including an inclination; and
when viewed in a planar direction:
the mount substrate includes a region with a reduced formation density of the outer electrode; and
the region of the sealing resin layer with the increased thickness and the region of the mount substrate with the reduced formation density of the outer electrode overlap each other.
2. An electronic component device comprising:
a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface;
at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by the terminal electrode being joined to the mount electrode; and
a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted; wherein
the sealing resin layer includes an increased thickness region, and a top surface including an inclination;
a plurality of the outer electrodes are provided;
the outer electrodes include a signal outer electrode and a ground outer electrode; and
when viewed in a planar direction:
the mount substrate includes a region with an increased formation density of the ground outer electrode; and
the increased thickness region of the sealing resin layer and the region of the mount substrate with the increased formation density of the ground outer electrode overlap each other.
3. The electronic component device according to claim 1 , wherein the increased thickness region of the sealing resin layer includes the at least one substrate component provided therein.
4. The electronic component device according to claim 1 , wherein the increased thickness region of the sealing resin layer includes one of the at least one substrate component with a thickness that is greater than a thickness of another of the at least one substrate component in the increased thickness region of the sealing resin layer.
5. The electronic component device according to claim 1 , wherein
the sealing resin layer is defined by a molded resin layer; and
the increased thickness region of the sealing resin is defined by a gap between dies with increased thickness.
6. The electronic component device according to claim 1 , wherein the inclination of the top surface of the sealing resin layer is defined by a cut in the top surface of the sealing resin layer.
7. The electronic component device according to claim 2 , wherein a number of the ground outer electrodes is greater than a number of the signal outer electrodes.
8. The electronic component device according to claim 1 , wherein
a plurality of the outer electrodes are provided; and
one of the plurality of outer electrodes has a larger area than an area of another one of the plurality of outer electrodes.
9. The electronic component device according to claim 8 , wherein the area of the one of the plurality of outer electrodes is about twice the area of the another one of the plurality of outer electrodes.
10. The electronic component device according to claim 1 , wherein
the at least one substrate component includes a large height component and a small height component; and
the large height component is located in the increased thickness region and the small height component is located outside of the increased thickness region.
11. The electronic component device according to claim 1 , wherein
the at least one substrate component includes a plurality of substrate components; and
each of the plurality of substrate components is provided in the increased thickness region.
12. The electronic component device according to claim 7 , wherein at least one of the signal outer electrodes is provided in the increased thickness region.
13. The electronic component device according to claim 9 , wherein the one of the plurality of outer electrodes is provided outside of the increased thickness region.
14. The electronic component device according to claim 2 , wherein the increased thickness region of the sealing resin layer includes the at least one substrate component provided therein.
15. The electronic component device according to claim 2 , wherein the increased thickness region of the sealing resin layer includes one of the at least one substrate component with a thickness that is greater than a thickness of another of the at least one substrate component in the increased thickness region of the sealing resin layer.
16. The electronic component device according to claim 2 , wherein
the sealing resin layer is defined by a molded resin layer; and
the increased thickness region of the sealing resin is defined by a gap between dies with increased thickness.
17. The electronic component device according to claim 2 , wherein the inclination of the top surface of the sealing resin layer is defined by a cut in the top surface of the sealing resin layer.
18. The electronic component device according to claim 2 , wherein one of the plurality of outer electrodes has a larger area than an area of another one of the plurality of outer electrodes.
19. The electronic component device according to claim 2 , wherein
the at least one substrate component includes a large height component and a small height component; and
the large height component is located in the increased thickness region and the small height component is located outside of the increased thickness region.
20. The electronic component device according to claim 2 , wherein
the at least one substrate component includes a plurality of substrate components; and
each of the plurality of substrate components is provided in the increased thickness region.