Patent Assignment
Reel/Frame 042600/0926
Assignment of Assignor's Interest
Recorded: 2017-06-05
Pages: 5
Assignors
LIN, JING-CHENG
Executed: 2017-05-26
CHENG, LI-HUI
Executed: 2017-05-26
TSAI, PO-HAO
Executed: 2017-05-26
CHANG, JEH-YIN
Executed: 2017-05-26
KUO, LI-CHUNG
Executed: 2017-05-26
TSOU, HSIEN-JU
Executed: 2017-05-31
CHOU, YI
Executed: 2017-05-26
SHIH, YING-CHING
Executed: 2017-05-26
LU, SZU-WEI
Executed: 2017-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same