Patent Assignment
Reel/Frame 042601/0625
Assignment of Assignor's Interest
Recorded: 2017-06-05
Pages: 4
Assignors
WANG, CHONG
Executed: 2017-05-17
ZHANG, HAI FANG
Executed: 2017-05-17
LIU, XUAN JIE
Executed: 2017-05-17
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO.18 WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
Covered Property
(1)
Packaging Structure Including Interconnecs and Packaging Method Thereof