Patent Assignment
Reel/Frame 042646/0307
Assignment of Assignor's Interest
Recorded: 2017-06-08
Pages: 3
Assignee
JMJ KOREA CO., LTD.
102, GILJU-RO 425BEON-GIL, WONMI-GU, GYEONGGI-DO, BUCHEON-SI, 14487, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Package Having Heat Dissipating Structure