Patent Assignment
Reel/Frame 042655/0593
Assignment of Assignor's Interest
Recorded: 2017-06-08
Pages: 4
Assignors
BAE, KI CHEOL
Executed: 2017-05-29
PARK, CHUL WOO
Executed: 2017-05-29
LEE, KWANG SUB
Executed: 2017-05-29
LEE, SANG GYUN
Executed: 2017-05-29
JANG, SE YOUNG
Executed: 2017-05-29
CHO, CHI HYUN
Executed: 2017-05-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Assembly with Package on Package Structure and Electronic Device Including the Same