Patent Assignment
Reel/Frame 042660/0577
Assignment of Assignor's Interest
Recorded: 2017-06-09
Pages: 2
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8280, JAPAN
Covered Property
(1)
Semiconductor Module and Method of Manufacturing Semiconductor Module