Patent Assignment
Reel/Frame 042665/0788
Assignment of Assignor's Interest
Recorded: 2017-06-09
Pages: 10
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2015-03-13
WOYCHIK, CHARLES G.
Executed: 2015-03-13
SITARAM, ARKALGUD R.
Executed: 2015-03-24
SHEN, HONG
Executed: 2015-03-13
SUN, ZHUOWEN
Executed: 2015-03-13
WANG, LIANG
Executed: 2015-03-13
GAO, GUILIAN
Executed: 2015-03-24
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic Components with Features Wrapping Around Protrusions of Conductive Vias Protruding from Through-Holes Passing Through Substrates
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0668 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0751 →