Patent Assignment
Reel/Frame 042702/0936
Assignment of Assignor's Interest
Recorded: 2017-06-14
Pages: 2
Assignors
UEMATSU, YUTAKA
Executed: 2017-02-14
OSAKA, HIDEKI
Executed: 2017-02-14
TOBA, TADANOBU
Executed: 2017-02-17
SHIMBO, KENICHI
Executed: 2017-02-17
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8280, JAPAN
Covered Property
(1)
Semiconductor Device and Multi-Chip Module