Patent Assignment
Reel/Frame 042723/0919
Assignment of Assignor's Interest
Recorded: 2017-06-15
Pages: 6
Assignors
HAN, WON-GIL
Executed: 2017-06-02
KIM, BYONG-JOO
Executed: 2017-06-02
LEE, YONG-JE
Executed: 2017-06-02
LEE, JAE-HEUNG
Executed: 2017-06-02
HA, SEUNG-WEON
Executed: 2017-06-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package and Method of Manufacturing the Same