Patent Assignment
Reel/Frame 042745/0511
Assignment of Assignor's Interest
Recorded: 2017-06-19
Pages: 5
Assignors
CHIANG, YUNG-PING
Executed: 2017-05-03
WU, NIEN-FANG
Executed: 2017-05-04
HSIAO, MIN-CHIEN
Executed: 2017-05-03
CHIANG, YI-CHE
Executed: 2017-05-03
SHIH, CHAO-WEN
Executed: 2017-05-03
CHANG, SHOU-ZEN
Executed: 2017-05-18
LIU, CHUNG-SHI
Executed: 2017-05-03
YU, CHEN-HUA
Executed: 2017-05-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package with Antenna Element