Patent Assignment
Reel/Frame 042756/0144
Assignment of Assignor's Interest
Recorded: 2017-06-20
Pages: 4
Assignors
MORIKAWA, TAKAHIRO
Executed: 2017-06-02
WATANABE, NAOKI
Executed: 2017-06-02
YOSHIMOTO, HIROYUKI
Executed: 2017-06-02
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8280, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same