Patent Assignment
Reel/Frame 042761/0300
Assignment of Assignor's Interest
Recorded: 2017-06-20
Pages: 6
Assignors
PEI, HAO-JAN
Executed: 2017-04-25
TSAO, CHIH-CHIANG
Executed: 2017-04-25
CHEN, WEI-YU
Executed: 2017-04-25
LIN, HSIU-JEN
Executed: 2017-04-25
CHENG, MING-DA
Executed: 2017-06-09
HSIEH, CHING-HUA
Executed: 2017-04-25
LIU, CHUNG-SHI
Executed: 2017-05-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package with Fan-Out Structure