Patent Assignment
Reel/Frame 042774/0178
Assignment of Assignor's Interest
Recorded: 2017-06-21
Pages: 6
Assignors
JEONG, SANG-MOO
Executed: 2017-01-17
KIM, SEON-JU
Executed: 2017-01-17
KIM, HYE-WON
Executed: 2017-01-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Integrated Circuit Device