Patent Assignment
Reel/Frame 042782/0323
Assignment of Assignor's Interest
Recorded: 2017-06-22
Pages: 4
Assignors
CHING, KUO-CHENG
Executed: 2017-06-19
PAN, KUAN-TING
Executed: 2017-06-19
CHENG, KUAN-LUN
Executed: 2017-06-19
WANG, CHIH-HAO
Executed: 2017-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method of Forming the Same