IP Library Assignment 042786/0886
Patent Assignment
Reel/Frame 042786/0886

Assignment of Assignor's Interest

Recorded: 2017-06-22 Pages: 6
Assignors
LIN, YUSHENG
Executed: 2015-02-11
CARNEY, FRANCIS J.
Executed: 2015-02-17
CHEW, CHEE HIONG
Executed: 2015-02-16
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Package with Elastic Coupler and Related Methods
Application: 15/630,112 →
Publication: US 2017/0294362
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0594 →
Release of Security Interest in Patents Recorded at Reel 044481, Frame 0594 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064074/0363 →