Patent Assignment
Reel/Frame 042788/0707
Assignment of Assignor's Interest
Recorded: 2017-06-22
Pages: 3
Assignors
LEVESQUE, DANIEL WAYNE, JR
Executed: 2017-05-09
PIECH, GARRETT ANDREW
Executed: 2017-05-09
SHOREY, ARIC BRUCE
Executed: 2017-05-09
Assignee
CORNING INCORPORATED
SP-TI-03-01, CORNING, NEW YORK, 14831
Covered Property
(1)
Inorganic Wafer Having Through-Holes Attached to Semiconductor Wafer