Patent Assignment
Reel/Frame 042791/0084
Assignment of Assignor's Interest
Recorded: 2017-06-22
Pages: 4
Assignors
GUO, TA-PEN
Executed: 2015-09-01
DIAZ, CARLOS H.
Executed: 2015-09-01
COLINGE, JEAN-PIERRE
Executed: 2015-09-01
LIN, YI-HSIUNG
Executed: 2015-09-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Monolithic 3D Integration Inter-Tier Vias Insertion Scheme and Associated Layout Structure