Patent Assignment
Reel/Frame 042796/0010
Assignment of Assignor's Interest
Recorded: 2017-06-23
Pages: 8
Assignors
KAWASAKI, HIROYOSHI
Executed: 2017-05-23
KONDO, SHIGEKI
Executed: 2017-05-23
IKEDA, ATSUSHI
Executed: 2017-05-23
ROPPONGI, TAKAHIRO
Executed: 2017-05-23
HAGIWARA, TAKASHI
Executed: 2017-05-23
SOMA, DAISUKE
Executed: 2017-05-23
TSURUTA, KAICHI
Executed: 2017-05-23
SATO, ISAMU
Executed: 2017-05-23
KAWAMATA, YUJI
Executed: 2017-05-23
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint