Patent Assignment
Reel/Frame 042796/0467
Assignment of Assignor's Interest
Recorded: 2017-06-23
Pages: 10
Assignors
TSURUTA, KAICHI
Executed: 2017-06-20
SAITOH, TAKEO
Executed: 2017-06-20
MURAOKA, MANABU
Executed: 2017-06-20
OSHIMA, HIROKI
Executed: 2017-06-19
YAMASHITA, KOJI
Executed: 2017-05-12
KAWAHARA, SHINICHIRO
Executed: 2017-05-12
Assignees
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
NITTA CORPORATION
4-26, SAKURAGAWA 4-CHOME, NANIWA-KU, OSAKA, OSAKA-SHI, 556-0022, JAPAN
Covered Property
(1)
Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Using Solder Transfer Sheet