Patent Assignment
Reel/Frame 042809/0142
Assignment of Assignor's Interest
Recorded: 2017-06-14
Pages: 6
Assignors
MIN, BYOUNG-GUG
Executed: 2017-06-14
CHO, SUNGIL
Executed: 2017-06-14
CHOI, JAEHOON
Executed: 2017-06-14
KIM, SHI-KYUNG
Executed: 2017-06-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Manufacturing the Same