Patent Assignment
Reel/Frame 042845/0881
Assignment of Assignor's Interest
Recorded: 2017-06-28
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Heat Transferring Blocks and Methods of Manufacturing the Same