Patent Assignment
Reel/Frame 042870/0657
Assignment of Assignor's Interest
Recorded: 2017-06-30
Pages: 8
Assignors
YU, TA-JEN
Executed: 2017-06-28
HUNG, YU-SHENG
Executed: 2017-06-28
HSU, WEN-SUNG
Executed: 2017-06-28
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Method for Fabricating the Same