Patent Assignment
Reel/Frame 042874/0811
Assignment of Assignor's Interest
Recorded: 2017-06-16
Pages: 3
Assignee
ZHEJIANG MICROTECH MATERIAL CO., LTD.
BUILDING 14-108, 818 QIMING ROAD, YINZHOU DISTRICT, NINGBO CITY, ZHEJIANG, 315100, CHINA
Covered Property
(1)
Wafer De-Bonding Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.