Wafer de-bonding device
A wafer de-bonding device comprises a stage ( 1 ) for holding a device wafer and a carrier wafer bonded together, and a tool ( 2 ) with a gas outlet ( 2.2 ) disposed in proximity to the stage ( 1 ) through an adjustment device for control the tool ( 2 ) to move towards or away from the stage ( 1 ), the tool ( 2 ) being provided with a bit ( 2.1 ) to cut a notch into a film or an adhesive layer at a junction of the bonded wafers, the gas outlet ( 2.2 ) being provided on the tool bit ( 2.1 ), the tool ( 2 ) being further provided with a gas inlet ( 2.3 ) in communication with the gas outlet ( 2.2 ), the gas inlet ( 2.3 ) being connected to a gas jet generator so as to direct a gas jet towards the junction of the bonded wafers on the stage ( 2 ). The wafer de-bonding device has a high degree of automation and simple operations.
1. A wafer de-bonding device, comprising:
a stage for holding a device wafer and a carrier wafer bonded together;
a tool with a gas outlet disposed on an adjustable device for controlling the tool to move towards or away from the stage, the tool being provided with a bit to penetrate into a film or an adhesive layer at a junction between the device wafer and the carrier wafer bonded together to form a notch, the gas outlet being disposed on the tool bit, the tool being further provided with a gas inlet in communication with the gas outlet, the gas inlet being connected to a gas jet generator to deliver a gas jet towards the junction between the device wafer and the carrier wafer bonded together on the stage; and
an image acquisition device having an image acquisition end directed to the bit of the tool to acquire an image of the tool bit approaching the junction of the bonded wafers.
2. The wafer de-bonding device of claim 1 , further comprising a light source providing light illumination for the image acquisition device to acquire the image.
3. The wafer de-bonding device of claim 2 , wherein the light source irradiates light at an angle onto the bonded wafers on the stage, the light has a color that is sensible for the image acquisition device, and the light passes through the device wafer and the carrier wafer and is reflected by the film at the junction of the bonded wafers.
4. The wafer de-bonding device of claim 1 , further comprising a robotic arm equipped with a sucker through which the robotic arm sucks on upper one of the bonded device wafer and carrier wafer on the stage and remove it when it is separated from the lower one of the bonded device wafer and carrier wafer through the gas jet.
5. The wafer de-bonding device of claim 1 , further comprising a controller in communication with the image acquisition device and the adjustment device, the controller being configured to process and analyze the image captured by the image acquisition device so as to control the position of the tool through the adjustment device such that the bit of the tool is automatically aligned to the junction between the bonded wafers.
6. The wafer de-bonding device of claim 1 , further comprising a gas temperature adjustment device provided between the gas jet generator and the gas inlet to adjust temperature of the gas jet output from the gas outlet.
7. The wafer de-bonding device of claim 1 , wherein the gas outlet is disposed in an upper surface of the tool bit.
8. The wafer de-bonding device of claim 1 , wherein the tool bit has two gas outlets provided in an upper surface thereof, and the tool has a tapered slot provided in a side surface thereof.