Patent Assignment
Reel/Frame 042877/0580
Change of Name
Recorded: 2017-06-16
Pages: 6
Assignor
SANDIA CORPORATION
Executed: 2017-05-01
Assignee
NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC
P.O. BOX 5800, MS-0161, ALBUQUERQUE, NEW MEXICO, 87185
Covered Properties
(2)
Silicon Ball Grid Array Chip Carrier
Patent:
6,052,287 →
Application:
08/987,276 →
Heterogeneously Integrated Microsystem-On-A-Chip
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 2, 1997
From: BEECHAM GROUP, P.L.C.
To: PFIZER, INC.
Reel/Frame 008290/0037 →
Assignment of Assignor's Interest
Feb 23, 1998
From: PALMER, DAVID W.; CHU, DAHWEY; GASSMAN, RICHARD A.
To: SANDIA CORPORATION
Reel/Frame 008988/0474 →
Assignment of Assignor's Interest
Jan 20, 2004
From: CHANCHANI, RAJEN
To: SANDIA CORPORATION
Reel/Frame 014271/0394 →
Confirmatory License
Feb 9, 2004
From: SANDIA CORPORATION
To: ENERGY, U.S. DEPARTMENT OF
Reel/Frame 014316/0762 →
Change of Name
Sep 28, 2017
From: SANDIA CORPORATION
To: NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC
Reel/Frame 044050/0390 →