Patent Assignment
Reel/Frame 042883/0254
Assignment of Assignor's Interest
Recorded: 2017-07-03
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2017-06-05
SU, AN-JHIH
Executed: 2017-06-07
WU, CHI-HSI
Executed: 2017-06-07
YEH, DER-CHYANG
Executed: 2017-06-05
YEH, MING SHIH
Executed: 2017-06-12
WU, WEI-CHENG
Executed: 2017-06-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Stacked Package-on-Package Structures