Multi-stacked package-on-package structures
A multi-stacked package-on-package structure includes a method. The method includes: adhering a first die and a plurality of second dies to a substrate, the first die having a different function from each of the plurality of second dies; attaching a passive device over the first die; encapsulating the first die, the plurality of second dies, and the passive device; and forming a first redistribution structure over the passive device, the first die, and the plurality of second dies, the passive device connecting the first die to the first redistribution structure.
1. A method comprising:
adhering a first die and a plurality of second dies to a substrate, the first die having a different function from each of the plurality of second dies;
attaching a passive device over the first die;
encapsulating the first die, the plurality of second dies, and the passive device; and
forming a first redistribution structure over the passive device, the first die, and the plurality of second dies, the passive device electrically connecting the first die to a redistribution line in the first redistribution structure.
2. The method of claim 1 , wherein the attaching the passive device comprises:
forming a second redistribution structure over the first die and the plurality of second dies; and
attaching the passive device to the second redistribution structure with conductive connections.
3. The method of claim 2 , wherein the first redistribution structure is disposed over the passive device and the second redistribution structure.
4. The method of claim 2 , wherein encapsulating the first die, the plurality of second dies, and the passive device comprises:
encapsulating the first die and the plurality of second dies with a first encapsulant; and
encapsulating the passive device with a second encapsulant different from the first encapsulant.
5. The method of claim 4 , further comprising:
forming through vias extending through the second encapsulant, the through vias extending from the second redistribution structure to the first redistribution structure.
6. The method of claim 4 , further comprising:
planarizing the first encapsulant such that top surfaces of the first encapsulant, the first die, and the plurality of second dies are level; and
planarizing the second encapsulant such that top surfaces of the second encapsulant and the passive device are level.
7. The method of claim 1 , wherein the attaching the passive device comprises:
attaching the passive device to die connectors of the first die with conductive connections.
8. The method of claim 7 , wherein the forming the first redistribution structure comprises:
forming the first redistribution structure over the passive device and the plurality of second dies.
9. The method of claim 7 , wherein the encapsulating comprises:
encapsulating the first die, the plurality of second dies, and the passive device with a first encapsulant.
10. The method of claim 9 , further comprising:
planarizing the first encapsulant such that top surfaces of the first encapsulant, the plurality of second dies, and the passive device are level.
11. The method of claim 1 , further comprising:
debonding the first die and the plurality of second dies from the substrate; and
attaching the first redistribution structure to a carrier substrate.
12. A method comprising:
adhering a plurality of first dies to a substrate;
encapsulating the plurality of first dies with a first encapsulant;
forming a first redistribution structure over the first encapsulant, the first redistribution structure electrically connected to the plurality of first dies;
forming through vias in electrical connection with the first redistribution structure;
attaching a passive device to the first redistribution structure with conductive connections, the passive device surrounded by the through vias; and
forming a second redistribution structure over the passive device, the second redistribution structure electrically connected to the through vias and the passive device.
13. The method of claim 12 , wherein the passive device is free of active regions.
14. The method of claim 12 , further comprising:
encapsulating the passive device and the through vias with a second encapsulant; and
planarizing the second encapsulant such that top surfaces of the second encapsulant, the through vias, and the passive device are level.
15. The method of claim 14 , wherein encapsulating the passive device comprises:
filling the second encapsulant between the passive device and the first redistribution structure.
16. The method of claim 12 , further comprising:
filling a molding compound between the passive device and the first redistribution structure.
17. A method comprising:
adhering a first die and a plurality of second dies to a substrate;
attaching a passive device to die connectors of the first die with conductive connections;
encapsulating the passive device, the first die, and the plurality of second dies with an encapsulant;
planarizing the encapsulant such that top surfaces of the encapsulant, the passive device, and the plurality of second dies are level; and
forming a redistribution structure over the encapsulant, a redistribution line in the redistribution structure being electrically connected to the first die through the passive device.
18. The method of claim 17 , wherein the passive device comprises through vias electrically connecting the first die to the redistribution line.
19. The method of claim 17 , wherein the encapsulating comprises:
filling the encapsulant between the passive device and the first die.
20. The method of claim 17 , further comprising:
filling a molding compound between the passive device and the first die.