Patent Assignment
Reel/Frame 042883/0787
Assignment of Assignor's Interest
Recorded: 2017-07-03
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packages with Si-Substrate-Free Interposer and Method Forming Same