Patent Assignment
Reel/Frame 042889/0161
Assignment of Assignor's Interest
Recorded: 2017-07-05
Pages: 4
Assignors
CHUANG, NAN-CHIN
Executed: 2017-06-09
YANG, CHING-FENG
Executed: 2017-06-09
WU, KAI-CHIANG
Executed: 2017-06-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package Having Multi-Band Antenna and Method of Forming the Same