Patent Assignment
Reel/Frame 042924/0106
Assignment of Assignor's Interest
Recorded: 2017-07-06
Pages: 8
Assignors
KIM, KI-WOONG
Executed: 2017-04-28
KIM, HYO-JUNG
Executed: 2017-06-02
SEO, KIEUN
Executed: 2017-05-08
JANG, KI HOON
Executed: 2017-04-28
KWON, BYOUNGHO
Executed: 2017-04-28
YOON, BOUN
Executed: 2017-04-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Three-Dimensional Semiconductor Devices