Patent Assignment
Reel/Frame 042929/0013
Assignment of Assignor's Interest
Recorded: 2017-07-07
Pages: 2
Assignor
KURITA, YOICHIRO
Executed: 2015-05-07
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Bonding Method of Semiconductor Chip and Bonding Apparatus of Semiconductor Chip