Patent Assignment
Reel/Frame 042929/0168
Assignment of Assignor's Interest
Recorded: 2017-07-07
Pages: 2
Assignor
NISHIMURA, ISAMU
Executed: 2017-06-22
Assignee
ROHM CO., LTD.
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, KYOTO, 615-8585, JAPAN
Covered Property
(1)
Electronic Component Having a Chip Mounted on a Substrate with a Sealing Resin and Manufacturing Method Thereof