Patent Assignment
Reel/Frame 042930/0412
Assignment of Assignor's Interest
Recorded: 2017-07-07
Pages: 9
Assignors
KIM, SOON-WOOK
Executed: 2017-06-13
PENG, LAN
Executed: 2017-06-13
VERDONCK, PATRICK
Executed: 2017-06-13
MILLER, ROBERT
Executed: 2017-06-14
BEYER, GERALD PETER
Executed: 2017-06-13
BEYNE, ERIC
Executed: 2017-06-14
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method of Bonding Semiconductor Substrates