Patent Assignment
Reel/Frame 043026/0309
Assignment of Assignor's Interest
Recorded: 2017-07-17
Pages: 6
Assignors
TOSHIMA, HIROYUKI
Executed: 2017-06-26
SHIMADA, ATSUSHI
Executed: 2017-07-12
HIRASAWA, TATSUO
Executed: 2017-07-12
HATANO, TATSUO
Executed: 2017-07-12
FURUKAWA, SHINJI
Executed: 2017-07-12
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method for Forming Copper Film