Patent Assignment
Reel/Frame 043029/0731
Assignment of Assignor's Interest
Recorded: 2017-07-18
Pages: 7
Assignors
LEE, BOK-YOUNG
Executed: 2017-06-13
KANG, SUNG-WOO
Executed: 2017-06-13
LEE, SANG-HYUN
Executed: 2017-06-13
AHN, HAK-YOON
Executed: 2017-06-14
OH, YOUNG-MOOK
Executed: 2017-06-13
LEE, IN-KEUN
Executed: 2017-06-13
OH, SEONG-HAN
Executed: 2017-06-13
CHOI, YOUNG-HUN
Executed: 2017-06-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same