Patent Assignment
Reel/Frame 043052/0439
Assignment of Assignor's Interest
Recorded: 2017-06-29
Pages: 5
Assignors
YUN, GEUM HEE
Executed: 2017-06-09
LEE, HWA YOUNG
Executed: 2017-06-09
LEE, SU YEON
Executed: 2017-06-09
PARK, YONG JIN
Executed: 2017-06-13
YOON, SOO YOUNG
Executed: 2017-06-09
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package and Photosensitive Resin Composition
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.