Patent Assignment
Reel/Frame 043054/0445
Assignment of Assignor's Interest
Recorded: 2017-07-20
Pages: 4
Assignor
MIWA, SATORU
Executed: 2017-07-08
Assignee
MEIKO ELECTRONICS CO., LTD.
5-14-15 OGAMI, AYASE-SHI, KANAGAWA, 252-1104, JAPAN
Covered Property
(1)
Encapsulated Circuit Module, And Production Method Therefor