Patent Assignment
Reel/Frame 043065/0550
Assignment of Assignor's Interest
Recorded: 2017-07-21
Pages: 5
Assignors
NA, DAE-HOON
Executed: 2017-04-11
KIM, HYUN-JIN
Executed: 2017-04-10
LEE, JANG-WOO
Executed: 2017-04-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package Capable of Testing Internal Signal Lines