Patent Assignment
Reel/Frame 043066/0043
Assignment of Assignor's Interest
Recorded: 2017-07-21
Pages: 7
Assignors
LEE, JUNG-HAN
Executed: 2017-05-15
LEE, SUN-GHIL
Executed: 2017-07-06
KANG, MYUNG-IL
Executed: 2017-05-15
LEE, JEONG-YUN
Executed: 2017-05-15
LEE, SEUNG-HUN
Executed: 2017-05-15
LEE, HYUN-JUNG
Executed: 2017-05-15
KIM, SUN-WOOK
Executed: 2017-05-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same