Patent Assignment
Reel/Frame 043075/0079
Assignment of Assignor's Interest
Recorded: 2017-07-24
Pages: 4
Assignors
YEH, JUNG-LIANG
Executed: 2017-07-18
WANG, MENG-JEN
Executed: 2017-07-18
TSAI, TSUNG-YUEH
Executed: 2017-07-18
HUNG, CHIH-MING
Executed: 2017-07-18
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Fan-Out Ball Grid Array Package Structure and Process for Manufacturing the Same