Patent Assignment
Reel/Frame 043091/0021
Assignment of Assignor's Interest
Recorded: 2017-07-25
Pages: 5
Assignors
PARK, DONG-SIK
Executed: 2017-04-17
KIM, DONG-WAN
Executed: 2017-04-17
HAN, JUNG-HOON
Executed: 2017-04-17
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Circuit Boards and Semiconductor Packages Including Protruding Pattern on Substrate