Patent Assignment
Reel/Frame 043104/0488
Assignment of Assignor's Interest
Recorded: 2017-07-26
Pages: 6
Assignors
SAIDO, SHUHEI
Executed: 2017-07-13
URUSHIHARA, MIKA
Executed: 2017-07-13
OKAJIMA, YUSAKU
Executed: 2017-07-13
Assignee
HITACHI KOKUSAI ELECTRIC INC.
15-12, NISHI-SHIMBASHI 2-CHOME, MINATO-KU, TOKYO, 105-8039, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Lid Cover and Method of Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.