Patent Assignment
Reel/Frame 043105/0923
Assignment of Assignor's Interest
Recorded: 2017-07-26
Pages: 10
Assignors
KATKAR, RAJESH
Executed: 2017-07-20
TAO, MIN
Executed: 2017-07-19
DELACRUZ, JAVIER A.
Executed: 2017-07-20
KIM, HOKI
Executed: 2017-07-19
AGRAWAL, AKASH
Executed: 2017-07-19
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multi-surface edge pads for vertical mount packages and methods of making package stacks
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →