Patent Assignment
Reel/Frame 043109/0861
Assignment of Assignor's Interest
Recorded: 2017-07-27
Pages: 3
Assignor
FEHKUHRER, ANDREAS
Executed: 2017-06-21
Assignee
EV GROUP E. THALLNER GMBH
DI ERICH THALLNER STRASSE 1, ST. FLORIAN AM INN, A-4782, AUSTRIA
Covered Property
(1)
Device and Method for at Least Partly Dissolving a Connecting Layer of a Temporarily Bonded Substrate Stack