Patent Assignment
Reel/Frame 043118/0647
Assignment of Assignor's Interest
Recorded: 2017-07-27
Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2013-03-01
YANG, CHING-JUNG
Executed: 2013-03-01
TU, CHIA-WEI
Executed: 2013-03-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and Apparatus for Packaging Pad Structure