Patent Assignment
Reel/Frame 043119/0367
Assignment of Assignor's Interest
Recorded: 2017-07-27
Pages: 2
Assignors
HSU, PO-YEN
Executed: 2017-07-19
FU, CHIH-CHENG
Executed: 2017-07-19
SHEN, TING-YING
Executed: 2017-07-19
Assignee
WINBOND ELECTRONICS CORP.
NO. 8, KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Resistive Random Access Memory Structure and Forming Method Thereof