Patent Assignment
Reel/Frame 043120/0152
Assignment of Assignor's Interest
Recorded: 2017-07-27
Pages: 12
Assignors
ISO, EIJI
Executed: 2017-07-19
IZUMI, SHINICHIRO
Executed: 2017-07-18
MAKI, YOSHIFUMI
Executed: 2017-07-18
TOMIOKA, HIROTSUGU
Executed: 2017-07-18
KAWADA, TSUYOSHI
Executed: 2017-07-24
Assignee
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Manufacturing Method for Electronic Component Including Electrode Formed by Removal of Insulating Layer by Laser Light