Patent Assignment
Reel/Frame 043125/0176
Assignment of Assignor's Interest
Recorded: 2017-07-28
Pages: 4
Assignors
SHIH, MENG-FU
Executed: 2017-07-19
HUANG, CHENG-LIN
Executed: 2017-06-05
LI, CHIEN-CHEN
Executed: 2017-06-06
CHU, CHE-JUNG
Executed: 2017-06-05
CHEN, WEN-MING
Executed: 2017-07-04
LIU, KUO-CHIO
Executed: 2017-07-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device Structure with Bumps
Patent:
10,014,218 →
Application:
15/492,525 →