Patent Assignment
Reel/Frame 043134/0160
Assignment of Assignor's Interest
Recorded: 2017-07-28
Pages: 4
Assignors
BAEK, YONG HO
Executed: 2017-06-23
CHO, JUNG HYUN
Executed: 2017-06-23
KIM, BYOUNG CHAN
Executed: 2017-06-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package